Tin Plated Copper Foil
Okwu Mmalite Ngwaahịa
Ngwaahịa ọla kọpa a na-ekpughe n'ikuku na-adịkarị mfeoxidationna mmepụta nke copper carbonate bụ isi, nke nwere nnukwu iguzogide, enweghị ike ijikwa ọkụ eletrik na nnukwu mfu nnyefe ike; mgbe e mechara tin plat, ngwaahịa copper na-etolite ihe nkiri tin dioxide n'ikuku n'ihi ihe onwunwe nke tin metal n'onwe ya iji gbochie oxidation ọzọ.
Ihe Ntọala
●Ọkwa dị elu nke a na-akpọ "Copper Foil", Cu (JIS: C1100/ASTM: C11000) nwere ihe karịrị 99.96%
Oke ọkpụrụkpụ ihe dị na ntọala
●0.035mm~0.15mm (0.0013 ~0.0059inch)
Obosara Ihe Ntọala
●≤300mm (≤11.8 sentimita asatọ)
Isi Ihe Okpomọkụ
●Dịka ihe ndị ahịa chọrọ si dị
Ngwa
●Ngwa eletriki na ụlọ ọrụ eletrọniki, nke obodo (dịka: ngwugwu ihe ọṅụṅụ na ngwaọrụ kọntaktị nri);
Usoro Arụmọrụ
| ihe | A na-eji ite tin agbaze agbaze | Ntinye Tin Na-abụghị Weld |
| Oke Obosara | ≤600mm (≤23.62inch) | |
| Oke ọkpụrụkpụ | 0.012~0.15mm (0.00047inches~0.0059inches) | |
| Ọkpụrụkpụ nke tin oyi akwa | ≥0.3µm | ≥0.2µm |
| Ọdịnaya Tin nke Tin Laịn | 65 ~ 92% (Enwere ike ịgbanwe ọdịnaya tin dịka usoro ịgbado ọkụ ndị ahịa si dị) | Tin Dị Ọcha 100% |
| Nguzogide Elu nke Tin Layer(Ω) | 0.3~0.5 | 0.1~0.15 |
| Nrapado | 5B | |
| Ike ọdụdọ | Mbelata arụmọrụ ihe dị na ntọala mgbe e mechara mkpuchi ≤10% | |
| Ogologo | Mbelata arụmọrụ ihe dị na ntọala mgbe e mechara mkpuchi ≤6% | |
![[VLP] Mpempe akwụkwọ ọla kọpa ED dị oke ala](https://cdn.globalso.com/civen-inc/VLP-Very-Low-Profile-ED-Copper-Foil-300x300.png)
