[RTF] E mesoo ED ọla kọpa
Okwu Mmalite ngwaahịa
RTF, foil ọla kọpa eletrọltic na-agbanwe agbanwe bụ foil ọla kọpa nke agbagoro n'ogo dị iche iche n'akụkụ abụọ. Nke a na-eme ka ike peel nke akụkụ abụọ nke foil ọla kọpa dị ike, na-eme ka ọ dị mfe iji dị ka oyi akwa nke etiti maka ijikọ na ihe ndị ọzọ. Ọzọkwa, usoro ọgwụgwọ dị iche iche dị n'akụkụ abụọ nke ihe mkpuchi ọla kọpa na-eme ka ọ dịkwuo mfe itching akụkụ dị gịrịgịrị nke oyi akwa. N'ime usoro nke ịmepụta panel circuit (PCB), akụkụ a na-emeso ọla kọpa na-etinye aka na ihe dielectric. Akụkụ drum a na-emeso dị njọ karịa akụkụ nke ọzọ, nke na-eme ka adhesion dị ukwuu na dielectric. Nke a bụ isi uru karịa ọkọlọtọ electrolytic ọla kọpa. Akụkụ matte anaghị achọ ọgwụgwọ ọ bụla ma ọ bụ ọgwụgwọ kemịkalụ tupu etinyere fotoresisist. Ọ na-ama ike ike zuru ezu inwe ezigbo laminating iguzogide adhesion.
Nkọwapụta
CIVEN nwere ike weta foil ọla kọpa RTF electrolytic nwere oke nha nke 12 ruo 35µm ruo 1295mm obosara.
Arụmọrụ
The elu okpomọkụ elongation tụgharịa mesoo electrolytic ọla kọpa foil bụ doro a kpọmkwem plating usoro ịchịkwa size nke ọla kọpa etuto na-ekesa ha even. Elu ọla kọpa ahụ a tụgharịrị na-egbuke egbuke nwere ike ibelata ịdị njọ nke foil ọla kọpa a chịkọtara ọnụ wee nye ike bee zuru oke nke foil ọla kọpa. (Lee tebụl nke 1)
Ngwa
Enwere ike iji ya mee ihe maka ngwaahịa ugboro ugboro na laminates dị n'ime, dị ka ọdụ ụgbọ ala 5G na radar ụgbọala na ngwa ndị ọzọ.
Uru
Ike njikọ dị mma, lamination multi-layer na-arụ ọrụ nke ọma na arụ ọrụ etching dị mma. Ọ na-ebelata ikike nke obere sekit ma na-ebelata oge okirikiri usoro.
Isiokwu 1. Arụmọrụ
Nhazi | Nkeji | 1/3OZ (12μm) | 1/2OZ (18μm) | 1OZ (35μm) | |
Cu ọdịnaya | % | min. 99.8 | |||
Ibu Mpaghara | g/m2 | 107±3 | 153±5 | 283±5 | |
Ike ọdụdọ | RT (25 ℃) | Kg/mm2 | min. 28.0 | ||
HT (180 ℃) | min. 15.0 | min. 15.0 | min. 18.0 | ||
Ogologo oge | RT (25 ℃) | % | min. 5.0 | min. 6.0 | min. 8.0 |
HT (180 ℃) | min. 6.0 | ||||
Isi ike | Shiny (Ra) | μm | max. 0.6 / 4.0 | max. 0.7/5.0 | max. 0.8/6.0 |
Matte(Rz) | max. 0.6 / 4.0 | max. 0.7/5.0 | max. 0.8/6.0 | ||
Ike bee | RT (23 ℃) | Kg/cm | min. 1.1 | min. 1.2 | min. 1.5 |
Ọnụego kwadara nke HCΦ(18%-1hr/25℃) | % | max. 5.0 | |||
Mgbanwe nke agba (E-1.0hr/190℃) | % | Ọ dịghị | |||
Solder na-ese n'elu 290 ℃ | Nkeji | max. 20 | |||
Pinhole | EA | efu | |||
Preperg | ---- | FR-4 |
Mara:1. Rz uru nke ọla kọpa foil n'elu elu bụ ule kwụsiri ike, ọ bụghị uru a na-ekwe nkwa.
2. Peel ike bụ ọkọlọtọ FR-4 osisi ule ule (5 Ibé akwụkwọ nke 7628PP).
3. Oge nkwenye dị mma bụ ụbọchị 90 site na ụbọchị nnata.