Roughening Post-ọgwụgwọ nke ọla kọpa: “Anchor Lock” Technology Interface na Comprehensive Application Analysis

N'ubi nkefoil ọla kọpan'ichepụta, roughening post-ọgwụgwọ bụ isi usoro maka imeghe ihe si interface bonding ike. Edemede a na-enyocha mkpa ọgwụgwọ roughening si n'akụkụ atọ: mmetụta anchoring n'ibu, usoro mmejuputa iwu ụzọ, na njedebe ojiji. Ọ na-enyocha uru ngwa nke teknụzụ a na mpaghara dịka nkwukọrịta 5G na batrị ume ọhụrụ, dabere naCIVEN METAL's teknuzu ọganihu.

1. Ọgwụgwọ na-agba agba: Site na "Ọnyà dị nro" ruo "Interface Anchored"

1.1 Ọdịmma na-egbu egbu nke elu dị larịị

The mbụ roughness (Ra) nkefoil ọla kọpaN'elu ala na-adịkarị obere karịa 0.3μm, nke na-eduga n'okwu ndị a n'ihi njirimara yiri enyo:

• Njikọ anụ ahụ ezughi oke: Mpaghara kọntaktị na resin bụ naanị 60-70% nke uru usoro iwu.
• Ihe mgbochi kemịkalụ: Otu oyi akwa oxide (Cu₂O ọkpụrụkpụ ihe dị ka 3-5nm) na-egbochi ikpughe nke otu nọ n'ọrụ.
• Mmetụta nrụgide okpomọkụ: Ọdịiche dị na CTE (Coefficient of Thermal Expansion) nwere ike ime ka delamination interface (ΔCTE = 12ppm / ° C).

1.2 Ọganihu nka nka atọ dị mkpa na usoro mkparị

Site n'ịmepụta nhazi akụkụ atọ dị n'ọkwa micron (lee foto 1), oyi akwa ahụ siri ike na-enweta:

• Mechanical Interlocking: Ụdị ntinye nke resin "barbed" anchoring (omi> 5μm).
• Ntinye kemịkalụ: Ikpughe (111) ụgbọ elu kristal na-arụ ọrụ dị elu na-abawanye njupụta saịtị njikọ na saịtị 10⁵/μm².
• Nchekwa nrụgide okpomọkụ: Ọdịdị porous na-etinye ihe karịrị 60% nke nrụgide okpomọkụ.
• Ụzọ Usoro: Acidic ọla kọpa plating ngwọta (CuSO₄ 80g/L, H₂SO₄ 100g/L) + Pulse Electro-deposition (ọrụ okirikiri 30%, ugboro 100Hz)
• Atụmatụ nhazi:
  • Ogologo dendrite ọla kọpa 1.2-1.8μm, dayameta 0.5-1.2μm.
  • Ọdịnaya oxygen dị n'elu ≤200ppm (nyocha XPS).
  • Nguzogide kọntaktị <0.8mΩ·cm².
• Ụzọ Usoro: Cobalt-nickel alloy plating solution (Co²+ 15g/L, Ni²+ 10g/L) + Mmeghachi omume mgbanwe kemịkalụ (pH 2.5-3.0)
• Atụmatụ nhazi:
  • CoNi alloy nha nha 0.3-0.8μm, njupụta njupụta> 8 × 10⁴ ahụ / mm².
  • Ọdịnaya oxygen dị n'elu ≤150ppm.
  • Nguzogide kọntaktị <0.5mΩ·cm².

2. Red Oxidation vs. Black Oxidation: Usoro Nzuzo N'azụ Agba

2.1 Red Oxidation: “Amam” ọla kọpa

2.2 Oxidation ojii: Alloy “Armor”

2.3 Echiche Azụmahịa n'azụ nhọrọ agba

Ọ bụ ezie na ndị isi arụmọrụ egosi (adhesion na conductivity) nke red na nwa oxidation dị iche na-erughị 10%, ahịa na-egosi a doro anya dị iche iche:

• Ọla kọpa na-acha uhie uhie Oxidized: Akaụntụ maka 60% nke ahịa ahịa n'ihi uru ọ bara uru (12 CNY/m² vs. black 18 CNY/m²).
• Ọla kọpa Black Oxidized: Na-achị ahịa ahịa dị elu (FPC nke ụgbọ ala, PCBs millimeter-wave) nwere oke ahịa 75% n'ihi:
  • Mbelata 15% na mfu ugboro ugboro (Df = 0.008 vs. red oxidation 0.0095 na 10GHz).
  • 30% kwalitere nguzogide CAF (Conductive Anodic Filament).

3. CIVEN METAL: "Nano-Level Masters" nke Roughening Technology

3.1 Teknụzụ “Gradient Roughening” ọhụrụ

Site na njikwa usoro nke agba atọ,CIVEN METALna-ebuli nhazi elu elu (lee foto 2):

1. Nano-Crystalline Mkpụrụ Layer: Electro-deposition nke ọla kọpa cores 5-10nm n'ogo, njupụta> 1 × 10¹¹ ahụ / cm².
2. Mmụba Micron Dendrite: Pulse ugbu a njikwa dendrite nghazi (na-ebute ụzọ (110) ntụziaka).
3. Mfefe elu: Organic silane njikọ njikọ (APTES) mkpuchi mma oxidation iguzogide.

3.2 Arụmọrụ karịrị ụkpụrụ ụlọ ọrụ

3.3 Matrix Ngwa Ọgwụgwụ

• 5G Base Station PCB: Na-eji foil ọla kọpa oxidized ojii (Ra = 1.5μm) iji nweta mfu ntinye ntinye <0.15dB/cm na 28GHz.
• Ndị na-anakọta batrị ike: Red oxidizedfoil ọla kọpa(ike ike 380MPa) na-enye ndụ okirikiri> okirikiri 2000 (usoro okirikiri 1500 mba).
• Aerospace FPCs: The roughened oyi akwa na-eguzogide okpomọkụ si -196°C ruo +200°C maka 100 okirikiri na-enweghị delamination.

4. Ọgbọ agha Ọdịnihu maka Foil Copper Roughened

4.1 Ultra-Roughening Technology

Maka mkpa nzikọrịta ozi 6G terahertz, a na-emepụta usoro serrated na Ra = 3-5μm:

• Dielectric Constant Stability: Emelitere na ΔDk <0.01 (1-100GHz).
• Nguzogide okpomọkụ: E wedara site na 40% (na-enweta 15W/m·K).

4.2 Smart Roughening Systems

Nchọpụta ọhụụ AI jikọtara ọnụ + nhazi usoro siri ike:

• Nleba anya n'elu oge: Nlele ugboro 100 okpokolo agba kwa nkeji.
• Ndozi njupụta dị ugbu a: nkenke ±0.5A/dm².

Ọla kọpa roughening mgbe ọgwụgwọ esitela na “usoro nhọrọ” gaa na “mmụba arụmọrụ.” Site ọhụrụ usoro na oke mma njikwa,CIVEN METALemela ka teknụzụ na-eme mkpọtụ gaa na nkenke ọkwa atọm, na-enye nkwado ihe ndabere maka nkwalite ụlọ ọrụ eletrọnịkị. N'ọdịnihu, n'ọsọ maka teknụzụ ka mma, ugboro dị elu na teknụzụ ndị a pụrụ ịdabere na ya, onye ọ bụla maara "koodu micro-level" nke nkà na ụzụ na-eme mkpọtụ ga-achịkwa usoro dị elu nke ụlọ ọrụ ahụ.foil ọla kọpaụlọ ọrụ.

(Ebe data:CIVEN METALAkụkọ nka nka afọ 2023, IPC-4562A-2020, IEC 61249-2-21)